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18. January 2013

Thermal Bridging at NESEA BuildingEnergy: At Last!

from Jim D Aloisio

At the 2013 BuildingEnergy Conference in Boston on March 5th, the Northeast Sustainable Energy Association (NESEA) is hosting a workshop entitled Structural Detailing for Energy Efficient Building Envelopes. Russ Miller-Johnson and I will be co-facilitating.

This will be a three-hour, hands-on opportunity to learn strategies to mitigate thermal bridging of structural elements in buildings. We’ll also give participants a chance to bring their favorite (or worst) details of thermal bridging to the workshop, to get help with developing a way to modify the detail to reduce thermal bridging, or to bring a detail showing their favorite solution to a thermal bridging problem that they have developed.

The topic of thermal bridging has certainly been broached before at this venue – the annual conference regularly hosts the latest ideas from experts and practitioners in the building enclosure industry, as well as those in the green energy field. However, never before has the topic been explored so deeply as this roll-up-your-sleeves workshop. The goal is to share knowledge with your peers. This session will be of use to architects, structural engineers, envelope consultants, energy modelers, building enclosure commissioning agents, and contractors.

Schock will have a display booth in the Exhibit Hall (Booth 662), which will be open Wednesday and Thursday.

Registration is open!

More information: http://www.schock-us.com/en_us/news/buildingenergy-be-conference–908?filter-active=1

2 comments

Travis Niles
18. January 2013 um 09:27

Excited to have you at the Conference AND as a member!

Alex Krenczik
26. January 2013 um 05:59

Looking very much forward seeing you at our booth…

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